Your Reliable PCB Manufacturing Partner

PCB Fabrication & Manufacturing Services

Bringing a design to life requires more than a supplier—it requires a partner. We provide complete PCB fabrication and assembly services, from rapid prototypes to mass production. Our facilities are equipped to handle everything from standard single-layer boards to complex HDI and rigid-flex designs, ensuring we can meet your project’s demands.

Our expertise is backed by quality you can trust. Certified to IPC, J-STD, and ISO standards, we build reliable boards for demanding applications like medical and industrial. Our in-house process, which covers everything from fabrication and component sourcing to assembly and testing, simplifies your supply chain and accelerates your time to market. You’ll work directly with our engineers, ensuring clear communication and a team that’s dedicated to getting it right the first time.

Prototype PCBs

Test designs fast. Our rapid prototyping & DFM feedback help you eliminate costly flaws, ensuring a smooth path to production.

Multilayer PCBs

We fabricate multilayer PCBs up to 40 layers with options for blind/buried vias, impedance control and high‑Tg materials.

Flexible PCBs

We manufacture single to multilayer flex circuits with stiffener and coverlay options, and offer impedance control for high-speed designs.

Rigid‑flex PCBs

We engineer custom rigid-flex boards, using 3D modeling to ensure reliable stack-ups for dynamic bending in compact, high-shock environments.

Metal core PCBs

We manufacture MCPCBs for thermal control in high-power LEDs, power converters & automotive lighting, offering single & multilayer designs.

HDI PCBs

We build advanced HDI PCBs, from 1+N+1 to any-layer architectures, using stacked microvias to maximize your design's routing density.

Heavy Copper PCBs

We build heavy-copper PCBs up to 20 oz for high-current applications, combining different weights to optimize your stack-up.

High‑frequency PCBs

We build RF boards using Rogers & PTFE, ensuring consistent dielectric properties with controlled impedance and strict process control.

Ceramic PCBs

We build high-performance ceramic PCBs using thick-film & direct-bonded copper for power electronics, RF modules, and aerospace.

High‑Tg PCBs

We offer high-Tg boards (170–260 °C) to ensure your board’s reliability during lead-free assembly and high-temperature operation.

Halogen‑free PCBs

We build with halogen-free laminates, ensuring your design meets RoHS compliance and offers high thermal stability & performance.

Quick‑turn PCBs

Our express service delivers rigid PCB prototypes in as fast as 24 hours, with flex and rigid-flex boards in around 7 days.

Our PCB Manufacturing Capabilities

We’ve organized our manufacturing specs into clear tabs, so you can quickly review our capabilities for each board category.

Rigid PCB

Category	Attribute	Standard Capability (Cost-Effective & Fast)	Advanced Capability (Contact for Quote)
General Specs	Layer Count	2 – 10 Layers	12 – 40 Layers
	Material	FR-4 (Tg 130-140°C), FR-4 (Tg 150-160°C)	FR-4 (High-Tg 170-180°C), Rogers, Isola, Panasonic, Shengyi
	Board Thickness	1.0mm, 1.2mm, 1.6mm (±10%)	0.2mm – 6.0mm (±10%)
	Max. Board Dimensions	500 x 500 mm	600 x 1100 mm
Conductor Specs	Finished Copper Weight	1 oz (35μm), 2 oz (70μm)	0.5 oz (18μm), Heavy Copper (3-20 oz)
Conductor Specs	Min. Trace / Space	4 / 4 mil (0.1 / 0.1 mm)	2.5 / 2.5 mil (0.065 / 0.065 mm)
Drilling Specs	Min. Mechanical Drill	0.25mm (10 mil)	0.15mm (6 mil)
	Min. Laser Drill	N/A	0.075mm (3 mil) (For HDI)
	Aspect Ratio	8:1	16:1
	Via Type	Through-hole Vias	Blind Vias, Buried Vias, Via-in-Pad, Microvias
Solder Mask	Solder Mask Type	Liquid Photoimageable (LPI)	LPI
	Solder Mask Colors	Green, White, Black	Blue, Red, Yellow, Matte Green, Matte Black
	Min. Solder Mask Dam	4 mil (0.1mm)	3 mil (0.075mm)
Silkscreen	Silkscreen Colors	White	Black, Yellow, Red, Blue
Silkscreen	Min. Character Height	30 mil (0.762mm)	25 mil (0.635mm)
Surface Finish	Standard Finishes	HASL (Leaded), HASL (Lead-Free)	ENIG (Immersion Gold), Immersion Silver, Immersion Tin, OSP
Surface Finish	Advanced Finishes	N/A	ENEPIG (Immersion Gold Palladium), Hard Gold, Carbon Ink
Special Processes	Impedance Control	±10%	±5%
	HDI (High Density)	N/A	1+N+1, 2+N+2, Any Layer Interconnect (ALIC)
	Other Processes	N/A	Edge Plating, Castellated Holes, Countersinks/Counterbores, Gold Fingers

Flex PCB

Category	Attribute	Standard Capability (Cost-Effective & Fast)	Advanced Capability (Contact for Quote)
General Specs	Layer Count	1 – 4 Layers	6 – 8 Layers
	Construction Type	Adhesive Based	Adhesiveless
	Base Material	Polyimide (PI) – 1 mil, 2 mil	Polyimide (PI) – 0.5 mil, High-Performance PI
Conductor Specs	Base Copper Weight	0.5 oz (18μm), 1 oz (35μm)	1/3 oz (12μm), 2 oz (70μm)
Conductor Specs	Min. Trace / Space	4 / 4 mil (0.1 / 0.1 mm)	2 / 2 mil (0.05 / 0.05 mm)
Cover & Finish	Coverlay / Solder Mask	Polyimide Coverlay (1 mil), Flexible LPI Solder Mask	Polyimide Coverlay (0.5 mil), Matte Black/White LPI
	Surface Finishes	ENIG (Immersion Gold)	ENEPIG, Hard Gold (for fingers), OSP
	Silkscreen	White, Black	Yellow, Blue
Reinforcement & Mechanical	Stiffener Type	Polyimide (PI), FR-4	Stainless Steel, Aluminum
	Stiffener Thickness	0.1mm – 1.0mm	Up to 2.0mm
	Outline Method	Die Punching, Laser Cutting	Plasma Cutting, Contour Routing
Special Processes	Impedance Control	±10%	±5%
	EMI Shielding	N/A	Silver Ink Shielding, Cross-Hatched Copper Shield
	Min. Bend Radius	10x Circuit Thickness (Dynamic)	6x Circuit Thickness (Static)

Rigid-Flex PCB

Category	Attribute	Standard Capability (Cost-Effective & Fast)	Advanced Capability (Contact for Quote)
General Specs	Total Layer Count	4 – 12 Layers	14 – 20+ Layers
	Flex Layer Count	1 – 2 Flex Layers	4 – 8 Flex Layers
	Rigid Material	FR-4 (Tg 150-160°C)	High-Tg FR-4 (Tg 170-180°C), Halogen-Free
	Flex Material	Adhesive Based Polyimide (PI)	Adhesiveless Polyimide (PI)
Conductor & Lamination	Base Copper Weight	0.5 oz (18μm), 1 oz (35μm)	1/3 oz (12μm), 2 oz (70μm)
	Min. Trace / Space	4 / 4 mil (0.1 / 0.1 mm)	3 / 3 mil (0.075 / 0.075 mm)
	Lamination Type	Bondply / Prepreg Lamination	Adhesiveless Bonding, Air Gap Construction
Mechanical & Finish	Min. Mechanical Drill	0.2mm (8 mil)	0.15mm (6 mil)
	Via Type	Through-hole (Rigid Sections)	Blind/Buried Vias, Vias Spanning Rigid-Flex
	Surface Finishes	ENIG (Immersion Gold)	ENEPIG, Immersion Silver, Hard Gold (for fingers)
	Stiffener Support	FR-4, PI Stiffeners	Stainless Steel, Aluminum Stiffeners
Special Processes	Impedance Control	±10%	±5%
	Construction Method	Standard Lamination	“Bookbinder” Construction for high flex cycles
	Shielding on Flex	N/A	Silver Ink Shielding, Cross-Hatched Copper Shield

Aluminum PCB

Category	Attribute	Standard Capability (Cost-Effective & Fast)	Advanced Capability (Contact for Quote)
General Specs	Layer Count	1 Layer (Single-Sided)	2 Layers (Double-Sided)
	Base Material	Aluminum Alloy (5052, 1060)	Copper Core, Other Alloys
	Overall Board Thickness	1.0mm, 1.2mm, 1.6mm	0.8mm – 3.0mm
Thermal & Electrical	Thermal Conductivity	1.0 – 2.0 W/m·K	3.0 – 8.0+ W/m·K
	Dielectric Breakdown Voltage	2000V – 4000V AC	>6000V AC
	Finished Copper Weight	1 oz (35μm), 2 oz (70μm)	3 oz – 10 oz (Heavy Copper)
Mechanical Specs	Max. Board Dimensions	500 x 600 mm	600 x 1200 mm
	Min. Hole Size (Drill)	0.8mm	0.5mm
	Outline Profile Method	Routing, V-Scoring, Punching	N/A
	Mechanical Processes	N/A	Countersinks, Counterbores, Beveling
Solder Mask & Finish	Solder Mask Color	White (High Reflectivity), Black	Green, Custom Colors
	Surface Finish	HASL (Lead-Free), OSP	ENIG (Immersion Gold)
	Silkscreen Color	Black, White	Custom Colors

* N/A indicates this process is available under our Advanced Capability. Please review our Advanced specifications or contact us directly to discuss your requirements.

Certified Quality & Compliance

We build quality into every board we manufacture. This isn’t just a promise; it’s a process, verified by the world’s most recognized standards. For you, this means documented consistency, proven safety, and streamlined regulatory compliance.

Our ISO 9001 certification demonstrates our commitment to process control, ensuring consistent, repeatable precision.

We inspect all assemblies to IPC-A-610, the global standard, ensuring they meet Class 1, 2, or 3 visual and performance criteria.

By adhering to J-STD-001, we ensure all soldering materials and methods meet strict requirements for strong, defect-free joints.

As an ISO 13485 certified manufacturer, we ensure rigorous risk management and full traceability for medical devices.

Our IATF 16949 certification drives our zero-defect focus, ensuring robust reliability for your automotive components.

We adhere to ISO 14001 to manage our environmental footprint, ensure legal compliance, and improve resource efficiency.

Our UL recognition for materials (UL 94) and boards (UL 796) meets key safety and flammability standards for your product.

We comply with the RoHS Directive, restricting hazardous materials to ensure your product is safe and globally compliant.

Production Tiers & Lead Time

Service Tier	Typical Lead Time	Primary Application	Cost Advantage	Key Value
Prototype & Expedited	24 Hours - 5 Days	R&D, functional testing, quick-turn validation	Time-to-market driven	Speed to Market Rapidly turn your design into reality
Small-Mid Volume	5 - 10 Working Days	Pilot runs, NPI (New Product Introduction), early-market launch	Optimal balance of cost & speed	The Balanced Choice Quality, cost, and speed in perfect harmony
Mass Production	12+ Working Days (Scheduled)	Mature products, high-volume consumer electronics, industrial control	Lowest unit cost via economies of scale	Economies of Scale Reliable, consistent, and cost-competitive production at scale

Detailed Lead Time (For Prototypes & Small Volumes)

Board Complexity	Expedited	Standard
2-4 Layer Rigid PCB	2-3 Working Days	5-7 Working Days
6-8 Layer Rigid PCB	4-5 Working Days	8-10 Working Days
10-16 Layer / Standard HDI	5-7 Working Days	10-12 Working Days
18+ Layer / Advanced HDI / High-Frequency Materials	Contact Us for Custom Quote	Contact Us for Custom Quote
Flex / Rigid-Flex PCB	5-7 Working Days	10-12 Working Days
Aluminum PCB	3-4 Working Days	6-8 Working Days
*Note: Lead times are estimated in working days and are subject to final engineering review of your Gerber files. Shipping time is not included.

Why Choose Us?

Getting high-quality boards to your production line shouldn’t be a logistical headache. We operate as your trusted global PCB manufacturer by combining expert DFM engineering that ensures manufacturability with a supply chain that actually works. We simply handle the complexities of fabrication and global shipping so you receive reliable, spec-perfect PCBs exactly when you need them to bring your product to market.

Total In-House Control

We own the entire production line, with every stage of fabrication completed in our Shenzhen facility. This means you speak directly to the engineers actually building your board, avoiding the delays common with middlemen.

Engineering Support

You don’t just talk to reps; you work with DFM engineers. We perform a detailed, free design review on every file to catch errors before fabrication starts. It’s how we ensure your board is built right the first time.

Customer‑Centred Approach

We prioritize transparency. You receive a firm quote based on your specific technical requirements—such as layer count, finish, and thickness—with zero hidden fees. Plus, a dedicated account manager guides you from initial quote to final delivery.

Our PCB Manufacturing Equipment

A reliable product requires a flawless foundation. We utilize Laser Direct Imaging (LDI) for high-precision circuit definition, ensuring even the tightest trace widths are etched strictly to spec. We pair this with automated CNC drilling and routing systems that guarantee perfect layer registration and dimensional accuracy.

Deep inside the board, consistency is critical. Our computer-controlled plating lines monitor copper deposition in real-time, eliminating the risk of uneven plating in vias or on surfaces. Before shipping, every bare board undergoes 100% E-test and visual inspection, so you never receive a defective substrate.

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